china Thermoplastic Polyimide Moulding Powder CAS NO.28013-73-2

Min.Order: 100 Kilogram
Payment Terms: L/C,T/T

Product Details

Keywords

Other Names: PI
SolverPI-Powder 1600
Thermoplastic Polyimide Moulding Powder

Quick Details

ProName: china Thermoplastic Polyimide Moulding...
CasNo: 28013-73-2
Molecular Formula: (C22H26N2O4)n
Appearance: Light Yellow
Application: Press all kinds of machinery, electron...
DeliveryTime: 30days
Port: shanghai
ProductionCapacity: Kilogram/Day
Purity: 80%
LimitNum: 100 Kilogram

Superiority

EINECS No.: 28013-73-2

Place of Origin: Zhejiang, China (Mainland)
Type: Polymer
Brand Name: SolverPI
Model Number: SolverPI-Powder 1600
Purity: 80%
Product Name: Thermoplastic Polyimide Moulding Powder
Item No.: SolverPI-Powder 1600
Mesh size: ≥200 Mesh
SPECIFICATIONS:

Properties		Testing Method	Unit	Value
Basic performance	Appearance	/	/	Light Yellow
	Linear expansion coefficient of (23-30℃)	GB/T 1036-1989	1/℃	3.68*10-5
	Density(25℃)	/	g/cm3	1.38
	Intrinsic viscosity	Q/HSMT	dL/g	0.5-0.8
	Rockwell hardness (m)	GB/T 3398.2-2008	/	110
	Oxygen index	GB/T 2406.2-2009	%	46
	The vertical combustion	GB/T 2408-2008	level	V-0
Mechanical properties of	The tensile strength	GB/T 1040.2/1A-2006	MPa	108
	Elongation at break	GB/T 1040.2-2006	%	15
	The impact strength (no gap)	GB/ 1043.1/1eU-2008	KJ/m2	244
	The bending strength	GB/T 9341-2008	MPa	135
	The compression strength	GB/ T 1041-2008	MPa	136
	The coefficient of friction	GB/T 3960-1983(1989)	/	0.43
Thermal performance	The thermal deformation temperature(1.80MPa)	GB/T 1634.2-2004	℃	250
Thermal performance	Glass transition temperature (nitrogen atmosphere)	GB/T 19466.2-2009	℃	260
Electrical properties	Dielectric strength	GB/T 1408.1-2006	MV/m	16.3
Electrical properties	Volume resistivity	GB/T1410-2006	Ω·m	2.0*1014

Definition: A high molecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphous resin, the products made from thermoplastic PI is amber and transparent.

Main Characteristics:

l Creep resistance, radiation resistance, good wave penetrating ability;

l Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;

l Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

In a word, SOLVER Thermoplastic Polyimide Moulding Powder

(SolverPI-Powder 1600) can completely replace Mitsui AURUM.

Details

Jiande City Silibase Silicone New Material Manufacturer Co., Ltd. is one professional manufacturer specialized in producing all kinds of SILICONE BASED new materials.

At present we mainly focus on all kinds of SILICONE SURFACTANTS for different industries, including:

1)Agricultural Organo Silicone Agent (Silwet408, Break Thru S240, Silwet L-77, Q2-5211,Sylgard 309);

2)Silicone Flow and Leveling Agent (Equivalent of DC3667

Monmentive coatsil-1160, BYK300, 301, 302, 307, BYK302, Tego100, DC19, Coatsil-7001,Tego1484,BYK3510,DC57, Cogins S-83,Monmentive coatsil-7602,BYK L9565,Monmentive coatsil-2812

Monmentive coatsil-1162,BYK306, BYK333, Tego410, Tego432, Tego450, Tego245, Tego270, Wacker Silicone Fluid L066);

3)Silicone Surfactant for Rigid Foam / Flexible Foam / HR Flexible Foam (Equivalent of Momentive L-6980, L6900, L5565,L-5340, Y-10366, L-5309, Evonik B8404, B8525, B8462, B8110, DC-193, DC5357, DC5810, DC190, DC5043);

4)Silicone Surfactant for Personal Care(Equivalent of GE1188A, DC193).

Application:

Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc.

The demand of high grade diamond abrasive for thermoplastic PI is big because the traditional adhesives can not meet their requirements.

Moulded Samples: