Thermoplastic Polyimide Moulding Powder SolverPI-Powder 1600X CAS NO.32197-39-0

 Main Characteristics:

l         Creep resistance, radiation resistance, good wave penetrating ability;

l         Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;

l         Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

Product Name: Thermoplastic Polyimide Moulding Powder

Item No.: SolverPI-Powder 1600X

Appearance：Light Yellow

Linear expansion coefficient of(23-30℃)：3.68*10-5 1/℃

Density(25℃)：1.38 g/cm3

Intrinsic viscosity：0.5-0.8 dL/g

Rockwell hardness(m) 110

Oxygen index:46%

The vertical combustion:V-0 level

The tensile strength:108 MPa

Elongation at break:15%

The impact strength(no gap):244KJ/m2

The bending strength:135 MPa

The compression strength:136 MPa

The coefficient of friction：0.43

The thermal deformation temperature(1.80MPa)：250℃

Glass transition temperature (nitrogen atmosphere)：260℃

Dielectric strength：16.3MV/m

Volume resistivity：2.0*1014Ω·m

Definition: A high molecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphous resin, the products made from thermoplastic PI is amber and transparent.

Main Characteristics: l Creep resistance, radiation resistance, good wave penetrating ability; l Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly; l Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

In a word, SOLVER Thermoplastic Polyimide Moulding Powder (SolverPI-Powder1600) can completely replace Mitsui AURUM. Advantages when compared with other special engineering plastics:

1. Compared with PEEK\PPS, thermoplastic PI is a non crystalline, showing better stability of mechanical properties and size at high temperature condition. While the crystalline plastic will continue to crystallization or crystallization damage when using the temperature between Tg and Tm, causing the mechanical changes and decreasing dimensional stability, creep resistance reducing.

2. Compared with PTFE, better dimensional stability, better creep resistance and high strength, the shortage is worse corrosion resistance.

3. Stabler performance in the high or low temperature performance. The processing temperature can be 340-380 ℃, lower than Aurum. It no need heat treatment after the molding process.

4. Thermal properties: Tg:260 ℃, HDT:250 ℃, long-term use temperature is 240 ℃. At the same time, also has very good performance of low temperature resistant, will not brittle fracture at the temperature of -269 ℃ in liquid nitrogen. Compared with BMI The performance of BMI is more brittle, it will break off during the use of process.

SolverPI-Powder 1600X is showing as melting state during thermoplastic molding, the adhesion and toughness is better then not easier to be cracked. Usage life is longer.

BMI can be used for 4 hours, while SolverPI-Powder 1600X can be used continuously for 72 hours.

Using temperature can be higher. SolverPI-Powder 1600X can keep stable within 240 ℃ In the high-end abrasive in German are using polyimide as binder.

Application: Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc. The demand of high grade diamond abrasive for thermoplastic PI is big because the traditional adhesives can not meet their requiremen