Thermoplastic Polyimide Moulding Powder SolverPI-Powder 1600 CAS NO.32197-39-0

Main Characteristics:

l         Creep resistance, radiation resistance, good wave penetrating ability;

l         Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;

l         Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

Product Name: Thermoplastic Polyimide Moulding Powder 

Item No.: SolverPI-Powder 1600 

Mesh size: ≥200 Mesh 

Appearance：Light Yellow 

Linear expansion coefficient of (23-30℃)：GB/T 1036-1989 1/℃ 3.68*10-5 

Density(25℃) ：1.38 g/cm3 

Intrinsic viscosity ：0.5-0.8 dL/g 

Rockwell hardness(m)：110 

Oxygen index：46% 

The vertical combustion：V-0 level 

The tensile strength ：108 MPa 

Elongation at break：15% 

The impact strength(no gap)：244KJ/m2 

The bending strength：135MPa 

The compression strength：136MPa 

The coefficient of friction：0.43 

The thermal deformation temperature(1.80MPa)：250℃ 

Glass transition temperature (nitrogen atmosphere)：260℃ 

Dielectric strength：16.3MV/m 

Volume resistivity：2.0*1014Ω·m

 
Definition: A high molecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphous resin, the products made from thermoplastic PI is amber and transparent.

 Main Characteristics:

l         Creep resistance, radiation resistance, good wave penetrating ability;

l         Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;

l         Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

 In a word, SOLVER Thermoplastic Polyimide Moulding Powder

(SolverPI-Powder 1600) can completely replace Mitsui AURUM.

Application:

Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc.

The demand of high grade diamond abrasive for thermoplastic PI is big because the traditional adhesives can not meet their requirements.